The RAMs
IMO, nothing special in the physical appearance. The memory chips are just covered with mirror finished heatspreader with the "Team Xtreem" label. Oh, yeah......if you just wondered what chips inside the heatspreader is, I'll tell you.....it's Micron D9GMH. And they're high-binned ones.![]()
Let's see how well these modules can perform.......![]()
Test Setup
The the rig I used to test this memory is:
Proc: Core 2 Duo E6300
Mobo: Gigabyte GA965P DS3P
Memory: 2x1GB Team Xtreem DDR667C3
PSU: Tagan Dual Engine 700W
HSF: Scyhe Infinity + SmartCase LED Fan
Testing Methodology
I'll test these modules in two settings, the CL4-4-4 and CL3-3-3 setting.
For the CL4-4-4 setting, I used 4:5 divider to ensure optimal CPU performance. As for the CL3-3-3 setting, I used 1:1 divider setting.
For each test, I used Win Memtest to stress up the memory to the limit. I will use dual win memtest and leave no spare room for the system RAM. The pass criteria for each setting is running the Win Memtest above 300%.
Maybe, there's some of you wondering why I didn't use "the golden standard" Orthos Blend test for the mem stress test. The reason is.....simple....it's because win Memtest do more stress to the memory...and it can stress all the remaining spare memory in your RAM, leaving no empty room in it. (for comparison, ORTHOS 'just' using 1,3GB of your spare memory)
All settings were done straight from the BIOS, NO MEMSET USED!!!!!











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